• Touch integration for Resistive, Capacitive and Projected Capacitive technologies.
• Touch-screen customization
• LCD Air Bonding, OCA, and OCR touch-screen bonding technologies
• Heat dissipation solutions – both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
• Manufacturing of plastic elements with injection molding
• Production of aluminum mechanical parts with extrusion technology
• Design of mechanical parts with die-casting technology.
• Bending and pressing of sheet metal parts.
• Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays

• Heat dissipation solutions – both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
• Manufacturing of plastic components with injection molding
• Production of aluminum mechanical parts with extrusion technology
• Design of mechanical parts with die-casting technology
• Bending and pressing of sheet metal parts
• Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays, etc.

• Design investment limited to the carrier board
• Consolidated standards
• Scalable and future-proof solutions
• Long-term availability
• ARM and x86 compatibility
• Multi-vendor solutions
• Highly configurable
• Innovative and updatable solutions
• Reduced time-to-market

The Embedded NUC^™ (Next Unit of Computing) standard is a versatile, reduced form factor modeled on the Intel^® NUC systems. It targets fast-growing markets and represents an interesting solution for industrial applications. Embedded NUC^™ provides numerous interfaces in a compact format (3.94 x 3.94 in).

The Pico-ITX standard, with a reduced form factor (3.94 x 2.83 in), was developed to allow system developers and OEMs to create small and extremely lightweight devices, paving the way for new possibilities in IoT and M2M applications. Pico-ITX guarantees rich functionality sets, low energy consumption, and high performance.

Products optimized for artificial intelligence with specialized accelerators such as TPUs and NPUs.

Fanless embedded computer with the 11th Gen Intel^® Core^™ and Intel^® Celeron^® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

Focusing processors

• Intel^® Core^™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP)
• Intel^® Core^™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP)
• Intel^® Core^™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP)
• Intel^® Celeron^® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP
• Intel^® Core^™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
• Intel^® Core^™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
• Intel^® Core^™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial