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HMI Solutions
 
  Featured & product variants  
 
  • Touch integration for Resistive, Capacitive and Projected Capacitive technologies.
  • Touch-screen customization
  • LCD Air Bonding, OCA, and OCR touch-screen bonding technologies
  • Heat dissipation solutions – both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
  • Manufacturing of plastic elements with injection molding
  • Production of aluminum mechanical parts with extrusion technology
  • Design of mechanical parts with die-casting technology.
  • Bending and pressing of sheet metal parts.
  • Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays
 
     
 
Flexy Vision   Tanaro Vision   Santoka Vision   Santino Vision
 
 
msx-force-distance   msx-digital-counter   msx-analog   msx-temperature
 
     
 
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Fanless Embedded computers
 
  Featured & product variants  
 
  • Heat dissipation solutions – both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
  • Manufacturing of plastic components with injection molding
  • Production of aluminum mechanical parts with extrusion technology
  • Design of mechanical parts with die-casting technology
  • Bending and pressing of sheet metal parts
  • Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays, etc.
 
     
 
Titan   Palladio   Modular link   Easy Edge
 
 
  Titan   Palladio   Modular link   Easy Edge
 
     
 
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  SOM Modules & Single board computers  
 
Featured & product variants

  • Design investment limited to the carrier board
  • Consolidated standards
  • Scalable and future-proof solutions
  • Long-term availability
  • ARM and x86 compatibility
  • Multi-vendor solutions
  • Highly configurable
  • Innovative and updatable solutions
  • Reduced time-to-market
 
 
     
   
     
     
 
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3.5"
 
 
  • Scalable, future-proof solution
  • Long-term availability
  • Consolidated standard
  • Multi-vendor solution
  • Reduced time-to-market
 
 
     
 
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  Embedded NUC  
 

The Embedded NUC (Next Unit of Computing) standard is a versatile, reduced form factor modeled on the Intel® NUC systems. It targets fast-growing markets and represents an interesting solution for industrial applications. Embedded NUC provides numerous interfaces in a compact format (3.94 x 3.94 in).

 
 
     
 
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  Pico-ITX  
 

The Pico-ITX standard, with a reduced form factor (3.94 x 2.83 in), was developed to allow system developers and OEMs to create small and extremely lightweight devices, paving the way for new possibilities in IoT and M2M applications. Pico-ITX guarantees rich functionality sets, low energy consumption, and high performance.

 
 
     
 
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  AI-Optimised hardware  
 
Featured & product variants

Products optimized for artificial intelligence with specialized accelerators such as TPUs and NPUs.

Fanless embedded computer with the 11th Gen Intel® Core and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

Focusing processors

 
 
 
  • Intel® Core i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP)
  • Intel® Core i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP)
  • Intel® Core i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP)
  • Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP
  • Intel® Core i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
  • Intel® Core i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
  • Intel® Core i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
 
     
 
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