DP2T is the most compact & cost-saving automated
programming system. It is able to embed with either one unit of the
universal programmer (ProgMaster-S8) to support SPI Flash, EEPROM, MCU,
and CPLD…etc. Or All-in-one Programmer (NuProgPlus) to support all
devices such as SPI Flash, EEPROM, MCU, CPLD, eMMC & UFS…etc.
DP2T also supports both input & output in Tray or Tape & Reel. With the
stable quality & high efficiency, the UPH can easily go up to 1000. Save
your budget & lower your labor cost starts from DP2T now.
DP1000-G3 automated chip programming system is the
third generation of DP1000, which supports different input/output
peripherals to provide an overall solution for IC chip programming. It
supports most of the IC families, such as EEPROM, NAND/NOR FLASH, MCU,
eMMC, and UFS, etc.
The system can embed with 2 sets of ProgMaster-S8 chip Programmer or
NuProgPlus to provide up to 32 programming sites with stable quality &
high throughput. Additionally, the Auto Teach Feature will automatically
adjust the parameter to increase the productivity.
DP2000 is an automated programming system
specially designed for tube/tape in & tape out. The system is equipped
with a moving programming module and 4 nozzles to handle pick &
placement of IC input, positioning, programming and IC output. With 4
nozzles functioning synchronously with the moving programming module,
DP2000 easily achieves high throughput, 3,000UPH. This unique and
creative design already obtained a patent.
DP3000-G3 automated IC chip device programming
system is the third generation of DP3000. It is able to support CSP
packages as well as small size packages, like 1.5 x 0.8mm size chips.
DP3000-G3 supports different input/output peripherals, like tube, tape,
and tray, to provides an overall solution for IC chip device programming
with more advanced features.
DP3000-G3 supports all kinds of IC families, such as EEPROM, NAND/NOR
FLASH, MCU, eMMC, and UFS, etc. It is able to expand up to 96
programming sites, which will keep the high throughput even when
handling the high-density memory, like NAND Flash, eMMC, and UFS.
DP900 is a multi-functional packaging system that
integrates tube, tray and tape package equipment which allows
versatility and flexibility to meet different packing requirement. It is
designed to be fully automatic and each package equipment is modularized
as a sub-system for easy configuration and allows efficient work
turnaround time. In addition, DP900 supports JEDEC standard tray,
various SOP tubes and up to 22” tape reel, which is equipped with
different sensors to ensure packaging quality and prevent human or
system errors. Optional CCD camera can be added to the system for 2D
inspection and ink marker for IC marking. LCD keypad is available for
each sub-system to allow easier maintenance and troubleshooting.
Are you still changing the trays by yourself
whenever the tray is fully loaded? Auto Tray-250 is an automatic loader
specifically for tray input and output. It can accommodate up to 20 to
25 JEDEC standard trays at once and it can perfectly combine with
DediProg's automated IC programming systems, DP1000-G2 and DP3000-G2, or
other third party automation. Once the tray is filled up with IC, the
trays will exchange automatically, and it will only take about 25
seconds!
Auto Tray-260 is the first adjustable auto tray
loader that can be integrated with DP automated handlers. Unlike Auto
Tray-250, it is not only 2 in 1 function (tray in & tray out), but also
can support more than 20 types of nonstandard trays. The dimension
coverage is from 120 to 154mm width and 300 to 323mm length. Also, it is
capable to load 25 trays at once to make your automated production line
more efficient.
Auto Tray-350 series is specifically for tray
input and output, which supports 20 to 25 JEDEC standard trays. The
machine can perfectly combine with DediProg's automated IC programming
system and support online ink marking. Differ from the Auto Tray-250 is
that Auto Tray-350 can work independently as tray marker, and is able to
save eight setting files of tray condition for ink marking in the
embedded memory.
DP600-A is a new generation Automated taping
machine, which is designed to be simple and easy operated; tape width
adjustment can be finished within 10 seconds without any tool. DP600-A
supports devices packaged in 8~88mm width tape. With advanced
characteristics, DP600-A offers the best solution for the manufacturing
process.
DP600-M2A is a new generation Automated taping
machine, which is designed to integrate with third party's automation.
The input carrier tape reel holder can be designed based on third
party's automation need. DP600-M2A is easy to operate & tape width
adjustment can be finished within 10 seconds without any tool. It
supports devices packaged in 8~88mm width tape. With advanced
characteristics, DP600-M2A offers the best taping solution for the
different automation integration.
DP600-M2 is a desktop semi-auto taping machine
that is able to work independently; designed to be simple and easy to
operate. It has both PSA (Press sensitive adhesive) and heat sealing
functions. Support 8~88mm tape width; able to finish adjustment within
10 seconds without any adjustment tool. With advanced characteristics,
DP600-M2 offers the best solution for the manufacturing process.
ETF (Electrical Tape Feeder) series is a tool for
tape input, which is compatible with DediProg automated programming
systems.
There are 8mm, 12mm, 16mm, 24mm, 32mm and 44mm for different IC package
sizes. If the IC devices that you are going to program are in tapes,
then this is the right choice for you!
DediProg has designed a multiple feeders loading
preparation station, AFS-120, for tape input. It supports different
sizes of electrical tape feeders from 8mm up to 44mm. The maximum slots
are up to six units, and the power is fully connected for each slot. It
is designed with 4 mobile wheels, which can be moved around and set up
easily. Also, the bottom space is designed to store related parts, such
as carrier tapes, etc. AFS-120 is not only cost effective but efficiency
enhanced as well. Enjoy faster preparation and easy operation now!
LF-100P supports online label printing. It can
perfectly print barcode, QR code or simply series number, letters &
characters. The image resolution is up to 600dpi, the printing speed is
about 600mm/s, and it supports the label size from 4x4mm to 10x10mm.
Integrated with DP automated handler- DP series, it will benefit your
SMT production line to be more multi-functional and efficient.
ALM-610 (Auto Infrared Laser Marker) & ALM-610-NS
( Auto Nano Size Laser Marker) are both designed for Dediprog online
laser on programming handlers.
Both of them can be perfectly combined with DediProg automated
programming system. It can laser before or after programming. The IC top
marking area supports up to 30*30mm. ALM-610-NS is specially designed
for the small devices such as WLCSP and BGA; the minimum IC size can be
1.5*0.85mm.
The Backup Boot Flash-DIP is an ingenious tool
created by DediProg to force the application controller to work
automatically on the backup SPI Flash inserted in our tool DIP socket
and no more on the Main Serial Flash soldered on board. At the
connection on board, the BBF tool will disable automatically the Main
Serial Flash that does not need to be unsoldered.
The BBF-DIP
can be used as emulator by connecting it to the application DIP socket
(remove the DIP serial flash on the application) with our BBF cable
(included) and DIP cable adaptor. Or the BBF DIP can be used as a
programmer for serial flash in DIP packages if used together with SF100.
The Serial Flash can be easily changed manually thanks to the DIP
socket or even updated by connecting our SF100 programmer. The SF100
programmer is completely transparent for the application and will offer
to developer high flexibility for code trials or update.
Please note that the BBF modules only support 3.3V/2.5V IC.
The Backup Boot Flash is an ingenious tool created
by DediProg to force the application controller to work automatically on
the backup SPI Flash inserted in our tool SO8N socket and no more on the
Main Serial Flash soldered on board. At the connection on board, the BBF
tool will disable automatically the Main Serial Flash that does not need
to be unsoldered.
The Backup Boot Flash is an ingenious tool created
by DediProg to force the application controller to work automatically on
the backup SPI Flash inserted in our tool SO8W socket and no more on the
Main Serial Flash soldered on board. At the connection on board, the BBF
tool will disable automatically the Main Serial Flash that does not need
to be unsoldered.
The Backup Boot Flash is an ingenious tool created
by DediProg to force the application controller to work automatically on
the backup SPI Flash inserted in our tool SO16W socket and no more on
the Main Serial Flash soldered on board. At the connection on board, the
BBF tool will disable automatically the Main Serial Flash that does not
need to be unsoldered.
The Dual SO8W Backup Boot Flash is an ingenious
tool created by DediProg to force the application controller to work
automatically on the two backup SPI Flash inserted in our tool SO8W
sockets and no more on the two Main Serial Flash soldered on board. At
the connection, the BBF tool will disable automatically the two Main
Serial Flash that does not need to be
unsoldehttps://www.dediprog.com/product/DP600-A Dual SO8W tool allows
working on two Backup Serial Flash providing
that they are controlled by the same SPI bus and two different Chip
select in the application board.
The Backup Boot Flash QUAD (BBF-QUAD-8W) is an
ingenious tool created by DediProg to allow the application controller
to work on the backup SPI Flash inserted in our tool SO8W socket. It
allows the application controller to access the backup SPI Flash with
SPI single/Dual/Quad IO mode.
The Backup Boot Flash Kit (SO8W) is used as a
Serial Flash Emulator for easy code development to reduce your time to
market. Our Backup Boot Flash Module (included) can be connected to the
application by 3 different methods:
On the Main Serial flash package soldered
on board by using our BBF Test Clip(SO8) (included).
On our SMT 1.27mm Pin Header (included)
soldered in place of the Main Serial flash footprint for a better
stability by using the appropriate BBF cable (included).
On your application 2.54mm (2X5) BBF
connector (if application designed with) by using the appropriate
BBF cable (included).
The Backup Boot Flash Kit (SO16W) is used as a
Serial Flash Emulator for easy code development to reduce your time to
market. Our Backup Boot Flash Module (included) can be connected to the
application by 2 different methods:
On the Main Serial flash package soldered
on board by using our SO16W Test Clip (included).
On your application 2.54mm (2X5) BBF
connector (if application designed with) by using the appropriate
BBF cable (included).BF SO16W(300mil) Socket + SF100 Programmer
The Backup Boot Flash Kit (Dual SO8W) is used as a
Serial Flash Emulator for easy code development to reduce your time to
market. Our Backup Boot Flash tool (included) can be connected to the
application by 3 different methods:
On the Two Main Serial flash packages
soldered on board by using our Dedicated BBF Test Clip (included).
On our Two SMT 1.27mm Pin Headers
(included) soldered in place of the Two Main Serial flash footprints
for a better stability by using the appropriate 2.54mm to 1.27mm
cable adaptor-dual header (included)
On your application 2.54mm (2X5) BBF
connector (if application designed with) by using the appropriate
BBF cable (included).
The Backup Boot Flash Kit (SO8N) is used as a
Serial Flash Emulator for easy code development to reduce your time to
market. Our Backup Boot Flash Module (included) can be connected to the
application by 2 different methods:
On the Main Serial flash package soldered on board by using our SO8 Test
Clip (included).
On your application 2.54mm (2X5) BBF connector (if application designed
with) by using the appropriate BBF cable (included).
UFSProg Series is a professional reader tool to
read and write data in each LUN of UFS IC. With a powerful bridge
controller IC, DP7000, UFSProg series can support UFS v2.1 up to Gear 3
speed and USB3.1 Gen1 with UASP high-performance protocol.
Surface Mount TSOP56 socket is designed to be
soldered directly on TSOP56 PCB foot print. With this socket, engineers
no longer have to solder or desolder the TSOP56 chips during the
development phase.
%20socket.png)
.png)
%20Sockets.png)
.png)
